コンプリート！ 2.5 D Vs 3d Packaging 719656-2.5 D Vs 3d Packaging
2 5d Semiconductor Engineering • 25/3D Packaging Technology Challenges o In the following slides, some of the challenges in 25D/3D packaging technology relevant to space applications will be discussed Die attach 25/3D Packaging Path Finding 25D/3D packaging technologies are revitalizing creativity in high technology products We thought we knew what faster, better, lighter and 2.5 d vs 3d packaging